Lian Li Lancool III RGB Full Tower PC Case - Black

The Lian Li Lancool III provides amazing options for creating your next gaming PC. This case has great out-of-the-box cooling, including a front mesh panel that offers exceptional airflow in part thanks to four pre-installed 140mm fans, three of which feature RGB. The Lancool III can additionally accommodate up to three 360mm radiators, six additional fans, and multiple pump mounting positions. This case is ideal for high-end builds. With a large internal capacity, you’ll have plenty of options for components from E-ATX motherboards, and GPUs up to 420mm long, as well as multiple storage drives. Furthermore, with the extensive cable management options, your PC build will look clean and tidy.

Lian Li Lancool III Full Tower Case at a Glance:

• Exceptional cooling with support for multiple radiators and fans
• Excellent cable management options for a clean build
• Supports full length GPUs up to 420mm long
• Can support motherboards up to E-ATX (under 280mm)
• Up to 12 storage drives can be mounted inside
• Three 140mm RGB PWM fans pre-mounted

Outstanding Cooling

The Lancool III provides a plethora of options for keeping all your components cool. To begin with, the front mesh panel facilitates great airflow and dust filtration. This is due to it having 15mm holes 2mm apart offering an exceptional 51% porosity. Out of the box, this case comes with three 140mm RGB PWM fans pre-installed at the front, coupled with a 140mm PWM fan in the rear of the case. Alongside these fans, another three 120mm fans can be installed above the power supply chamber, and three 140mm fans can be attached to the top of the case.

For the enthusiast who wants to water-cool their components, the Lancool III presents many options. With three radiator mounting locations, at the front, top, and above the PSU that can even be used simultaneously, you’ll have plenty of scope cooling. Furthermore, a custom water loop can easily be assembled thanks to having multiple locations to mount a pump. There are three locations at the base of the case which can house a pump/reservoir combo, and one to the side of the motherboard which can be utilised for a pump or distro plate.

Stylish and Clean

Lian Li has created an impressively stylish case that looks amazing from any angle, while also offering great functionality. The front of the case catches the eye with its mix of mesh and solid panels. Furthermore, the front I/O can be housed either at the top or bottom of this panel to suit your needs. Moving to the sides, the Lancool III features 4.0mm tempered glass panels on both sides of the case that can be easily opened with aluminium handles that blend in with the rest of the case for a clean finish. Two panels below the glass have mesh sides that continue the perfect blend of aesthetics and functionality as they allow airflow into the PSU compartment.

As the Lancool III has tempered glass side panels on both sides, Lian Li has provided plenty of options for cable management. Behind the motherboard, a large area is covered by two magnetic hinged panels that can be used to cover most cabling. This is in addition to eight Velcro straps that are provided to keep your cable runs tidy. Finally, with four locations for fan controllers or ARGB hubs you can choose where to place them for the best results.

Wide Choice of Hardware

With the Lancool III as your PC chassis, you’ll have plenty of scope when it comes to component choices. To begin with, this case can fit motherboards ranging from Mini-ITX all the way to E-ATX boards (under 280mm wide). Furthermore, this PC case is able to house even the largest graphics cards easily, with 8 expansion slots provided and 420mm of clearance. You’ll also be able to install a powerful PSU to power all your components, as Lian Li has provided a dedicated chamber with 220mm of clearance for an ATX power supply.

If you are using your PC as a creative workstation, the Lancool III can house four 3.5" HDDs and eight 2.5" SSDs, or twelve 2.5" SSDs, for all your storage needs. This is done by using a smart combination of detachable panels in the PSU compartment, modular drive bays, three mounting points above the PSU compartment, and two more mounting points behind the motherboard.