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Product information "TG Putty - Advance"
TG Thermal Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible "gap filler", it evens out height differences and is therefore ideal as a replacement for thermal pads on graphics cards. Here, several types of thermal pads in different heights are usually used ex works, so when replacing the pads or converting the cooler to a GPU water cooler, several different pads are required.
The thermal putty is applied either with the spatulas provided or by hand (gloves recommended). It can be applied over a large area using the spatula. Alternatively, the thermal putty can be formed into small balls by hand, the size of which can be adjusted to the area to be applied (e.g. VRAM, SMD). The thermal putty can compensate for height differences of 0.2 to 3.0 mm.
TG Thermal Putty is available in three variants, which differ mainly in their thermal conductivity:
Putty Basic with medium thermal conductivity
Putty Advance with good thermal conductivity
Putty Pro with very good thermal conductivity
Note: Before application, the target surface should be thoroughly cleaned and degreased, for example with TG Cleaning Wipes or commercially available isopropanol.
Contents:
- Thermal Putty Advance
- 3x spatula
| Contents | |
| Weight (Contents) | 30 g |
| Materials | |
| Electrically Conductive | No |
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